NickelMaghrebV1, Main, Exploration, bibRecord, 000095

Structure, surface morphology and electrical properties of evaporated Ni thin films: Effect of substrates, thickness and Cu underlayer

Identifieur interne : 000095 ( Main/Exploration ); précédent : 000094; suivant : 000096

Structure, surface morphology and electrical properties of evaporated Ni thin films: Effect of substrates, thickness and Cu underlayer

Auteurs : M. Hemmous [Algérie] ; A. Layadi [Algérie] ; A. Guittoum [Algérie] ; N. Souami [Algérie] ; M. Mebarki [Algérie] ; N. Menni [Algérie]

Source :

Thin solid films [ 0040-6090 ] ; 2014.

RBID : Pascal:14-0167333

Descripteurs français

Pascal (Inist)
- Structure surface, Morphologie surface, Propriété électrique, Couche mince, Effet dimensionnel, Evaporation, Verre, RBS, Interface, Texture, Grosseur grain, Diffraction RX, Microscopie électronique balayage, Résistivité électrique, Mécanisme croissance, Effet contrainte, Valeur critique, Epaisseur couche, Nickel, Cuivre, Substrat mica, Substrat Al2O3, Substrat cuivre, Substrat silicium, 6855J, 7350, 6855A, 8115A.
Wicri :
- topic : Verre, Nickel, Cuivre.

English descriptors

KwdEn :
- Copper, Critical value, Electric resistivity, Electrical properties, Evaporation, Glass, Grain size, Growth mechanism, Interfaces, Layer thickness, Nickel, RBS, Scanning electron microscopy, Size effect, Stress effects, Surface morphology, Surface structure, Texture, Thin films, XRD.

Abstract

Series of Ni thin films have been deposited by thermal evaporation onto glass, Si(111), Cu, mica and Al₂O₃ substrates with and without a Cu underlayer. The Ni thicknesses, t, are in the 4 to 163 nm range. The Cu underlayer has also been evaporated with a Cu thickness equal to 27, 52 and 90 nm. The effects of substrate, the Ni thickness and the Cu underlayer on the structural and electrical properties of Ni are investigated. Rutherford Backscattering Spectroscopy was used to probe the Ni/Substrate and Ni-Cu underlayer interfaces and to measure both Ni and Cu thicknesses. The texture, the strain and the grain size values were derived from X-ray diffraction experiments. The surface morphology is studied by means of a Scanning Electron Microscope. The electrical resistivity is measured by the four point probe. The Ni films grow with the <111> texture on all substrates. The Ni grain sizes D increase with increasing thickness for the glass, Si and mica substrates and decrease for the Cu one. The strain ε is positive for low thickness, decreases in magnitude and becomes negative as t increases. With the Cu underlayer, the growth mode goes through two phases: first, the stress (grain size) increases (decreases) up to a critical thickness t_Cr, then stress is relieved and grain size increases. All these results will be discussed and correlated.

Affiliations:

Links toward previous steps (curation, corpus...)

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Le document en format XML

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<series><title level="j" type="main">Thin solid films</title>
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<profileDesc><textClass><keywords scheme="KwdEn" xml:lang="en"><term>Copper</term>
<term>Critical value</term>
<term>Electric resistivity</term>
<term>Electrical properties</term>
<term>Evaporation</term>
<term>Glass</term>
<term>Grain size</term>
<term>Growth mechanism</term>
<term>Interfaces</term>
<term>Layer thickness</term>
<term>Nickel</term>
<term>RBS</term>
<term>Scanning electron microscopy</term>
<term>Size effect</term>
<term>Stress effects</term>
<term>Surface morphology</term>
<term>Surface structure</term>
<term>Texture</term>
<term>Thin films</term>
<term>XRD</term>
</keywords>
<keywords scheme="Pascal" xml:lang="fr"><term>Structure surface</term>
<term>Morphologie surface</term>
<term>Propriété électrique</term>
<term>Couche mince</term>
<term>Effet dimensionnel</term>
<term>Evaporation</term>
<term>Verre</term>
<term>RBS</term>
<term>Interface</term>
<term>Texture</term>
<term>Grosseur grain</term>
<term>Diffraction RX</term>
<term>Microscopie électronique balayage</term>
<term>Résistivité électrique</term>
<term>Mécanisme croissance</term>
<term>Effet contrainte</term>
<term>Valeur critique</term>
<term>Epaisseur couche</term>
<term>Nickel</term>
<term>Cuivre</term>
<term>Substrat mica</term>
<term>Substrat Al2O3</term>
<term>Substrat cuivre</term>
<term>Substrat silicium</term>
<term>6855J</term>
<term>7350</term>
<term>6855A</term>
<term>8115A</term>
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<keywords scheme="Wicri" type="topic" xml:lang="fr"><term>Verre</term>
<term>Nickel</term>
<term>Cuivre</term>
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<front><div type="abstract" xml:lang="en">Series of Ni thin films have been deposited by thermal evaporation onto glass, Si(111), Cu, mica and Al<sub>2</sub>
O<sub>3</sub>
 substrates with and without a Cu underlayer. The Ni thicknesses, t, are in the 4 to 163 nm range. The Cu underlayer has also been evaporated with a Cu thickness equal to 27, 52 and 90 nm. The effects of substrate, the Ni thickness and the Cu underlayer on the structural and electrical properties of Ni are investigated. Rutherford Backscattering Spectroscopy was used to probe the Ni/Substrate and Ni-Cu underlayer interfaces and to measure both Ni and Cu thicknesses. The texture, the strain and the grain size values were derived from X-ray diffraction experiments. The surface morphology is studied by means of a Scanning Electron Microscope. The electrical resistivity is measured by the four point probe. The Ni films grow with the <111> texture on all substrates. The Ni grain sizes D increase with increasing thickness for the glass, Si and mica substrates and decrease for the Cu one. The strain ε is positive for low thickness, decreases in magnitude and becomes negative as t increases. With the Cu underlayer, the growth mode goes through two phases: first, the stress (grain size) increases (decreases) up to a critical thickness t<sub>Cr</sub>
, then stress is relieved and grain size increases. All these results will be discussed and correlated.</div>
</front>
</TEI>
<affiliations><list><country><li>Algérie</li>
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<region><li>Wilaya d'Alger</li>
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<name sortKey="Guittoum, A" sort="Guittoum, A" uniqKey="Guittoum A" first="A." last="Guittoum">A. Guittoum</name>
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<name sortKey="Layadi, A" sort="Layadi, A" uniqKey="Layadi A" first="A." last="Layadi">A. Layadi</name>
<name sortKey="Mebarki, M" sort="Mebarki, M" uniqKey="Mebarki M" first="M." last="Mebarki">M. Mebarki</name>
<name sortKey="Mebarki, M" sort="Mebarki, M" uniqKey="Mebarki M" first="M." last="Mebarki">M. Mebarki</name>
<name sortKey="Menni, N" sort="Menni, N" uniqKey="Menni N" first="N." last="Menni">N. Menni</name>
<name sortKey="Souami, N" sort="Souami, N" uniqKey="Souami N" first="N." last="Souami">N. Souami</name>
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Structure, surface morphology and electrical properties of evaporated Ni thin films: Effect of substrates, thickness and Cu underlayer

Structure, surface morphology and electrical properties of evaporated Ni thin films: Effect of substrates, thickness and Cu underlayer

Source :

Descripteurs français

English descriptors

Abstract

Links toward previous steps (curation, corpus...)

Le document en format XML

Pour manipuler ce document sous Unix (Dilib)

Pour mettre un lien sur cette page dans le réseau Wicri